Predictive model of corrosion kinetics for lead-free solder in polyvinyl chloride fire smoke environment
The corrosion kinetics,surface microstructure,and corrosion mechanism of Sn-3.0Ag lead-free solder were investigated using mass-loss method in the temperature range from 283.15 to 323.15 K in polyvinyl chloride fire smoke environment.The results show that the Sn-3.0Ag solder exhibits an increase in mass-loss from(22.09±2.01)to(44.66±1.20)g/m2 as the temperature increases from 283.15 to 323.15 K.Moreover,the corrosion kinetics is in accordance with Arrhenius law.The surface corrosion products of Sn-3.0Ag solder show a superposition growth trend.At 283.15 K,the surface of Sn-3.0Ag solder shows significant corrosion products.The corrosion process of Sn-3.0Ag lead-free solder is an electrochemical corrosion.Hydrogen evolution and oxygen abstraction reactions occur in the cathode,and the dissolution of the Sn-rich phase occurs in the anode.The corrosion products are Sn2iCl16(OH)14O6,SnO2,and SnO.
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