中国有色金属学报(英文版)2024,Vol.34Issue(7) :2304-2312.DOI:10.1016/S1003-6326(24)66542-8

聚氯乙烯火灾烟气环境中无铅焊料腐蚀动力学预测模型

Predictive model of corrosion kinetics for lead-free solder in polyvinyl chloride fire smoke environment

李倩 林锦 赵梦珂 黎昌海 陆守香
中国有色金属学报(英文版)2024,Vol.34Issue(7) :2304-2312.DOI:10.1016/S1003-6326(24)66542-8

聚氯乙烯火灾烟气环境中无铅焊料腐蚀动力学预测模型

Predictive model of corrosion kinetics for lead-free solder in polyvinyl chloride fire smoke environment

李倩 1林锦 1赵梦珂 1黎昌海 1陆守香1
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作者信息

  • 1. 中国科学技术大学火灾科学国家重点实验室,合肥 230026
  • 折叠

摘要

采用质量损失法研究聚氯乙烯火灾烟气环境中283.15~323.15 K温度范围内无铅Sn-3.0Ag焊料的腐蚀动力学、表面微观结构和腐蚀机理.结果表明,随着温度从283.15 K升高到323.15 K,Sn-3.0Ag焊料的质量损失从(22.09±2.01)g/m2增加到(44.66±1.20)g/m2.此外,腐蚀动力学符合阿伦尼乌斯定律.Sn-3.0Ag焊料表面腐蚀产物呈叠加生长趋势.在283.15 K,Sn-3.0Ag焊料的表面出现大量的腐蚀产物.Sn-3.0Ag无铅焊料的腐蚀过程为电化学腐蚀,阴极发生析氢和吸氧反应,阳极发生富锡相的溶解.腐蚀产物为Sn21Cl16(OH)14O6、SnO2和SnO.

Abstract

The corrosion kinetics,surface microstructure,and corrosion mechanism of Sn-3.0Ag lead-free solder were investigated using mass-loss method in the temperature range from 283.15 to 323.15 K in polyvinyl chloride fire smoke environment.The results show that the Sn-3.0Ag solder exhibits an increase in mass-loss from(22.09±2.01)to(44.66±1.20)g/m2 as the temperature increases from 283.15 to 323.15 K.Moreover,the corrosion kinetics is in accordance with Arrhenius law.The surface corrosion products of Sn-3.0Ag solder show a superposition growth trend.At 283.15 K,the surface of Sn-3.0Ag solder shows significant corrosion products.The corrosion process of Sn-3.0Ag lead-free solder is an electrochemical corrosion.Hydrogen evolution and oxygen abstraction reactions occur in the cathode,and the dissolution of the Sn-rich phase occurs in the anode.The corrosion products are Sn2iCl16(OH)14O6,SnO2,and SnO.

关键词

腐蚀/预测模型/Sn-3.0Ag焊料/火灾烟气/温度

Key words

corrosion/predictive model/Sn-3.0Ag solder/fire smoke/temperature

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基金项目

National Natural Science Foundation of China(52206180)

Fundamental Research Funds for the Central Universities,China(WK2320000050)

出版年

2024
中国有色金属学报(英文版)
中国有色金属学会

中国有色金属学报(英文版)

CSTPCDCSCD
影响因子:1.183
ISSN:1003-6326
参考文献量38
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