添加Mo和ZrO2纳米颗粒对Sn58Bi/Cu焊接接头界面性能和剪切强度的影响

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中文摘要：研究添加Mo和ZrO2纳米颗粒对Sn58Bi焊接接头界面性能和剪切强度的影响.利用扫描电子显微镜(SEM)、X射线能谱仪(EDX)和X射线衍射仪(XRD)分析Sn58Bi/Cu、Sn58Bi+Mo/Cu和Sn58Bi+ZrO2/Cu的界面显微组织.在Sn58Bi+Mo/Cu中检测到了金属间化合物(IMCs)MoSn2,在Sn58Bi+ZrO2/Cu中检测到了SnZr、Zr5Sn3、ZrCu和ZrSn2.两种复合材料焊料的IMC层均由Cu6Sn5和Cu3Sn组成.通过SEM图测量IMC层的厚度,结果表明,Sn58Bi+Mo/Cu和Sn58Bi+ZrO2/Cu的IMC层平均厚度分别为1.4431 μm和0.9112 μm.通过单搭接剪切测试法研究焊接接头的剪切强度.与Sn58Bi/Cu焊接接头相比,Sn58Bi+Mo/Cu和Sn58Bi+ZrO2/Cu焊接接头的平均最大载荷和剪切应力分别提高了 33％和69％.两种复合材料焊接接头相比,后者表现更佳,这是由于添加尺寸较小的ZrO2纳米颗粒改善了焊接接头的界面性能,从而提高了其强度.

外文标题：Effect of Mo and ZrO2 nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

外文摘要：The influence of Mo and ZrO2 nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO2/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn2 are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr5Sn3,ZrCu and ZrSn2 are detected in Sn58Bi+ZrO2/Cu solder joint.IMC layers for both composite solders comprise of Cu6Sn5 and Cu3Sn.The SEM images of these layers were used to measure the IMC layer's thickness.The average IMC layer's thickness is 1.4431 μm for Sn58Bi+Mo/Cu and 0.9112 μm for Sn58Bi+ZrO2/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO2/Cu solder joints are increased by 33％and 69％,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO2 nanoparticles improves the interfacial properties granting a stronger solder joint.

外文关键词：

lead-free solderinterfacial microstructureIMC layer thicknessshear strengthdislocation densityZrO2 nanoparticlesMo nanoparticles

作者：

Amares SINGH、Hui Leng CHOO、Wei Hong TAN、Rajkumar DURAIRAJ

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作者单位：

School of Engineering,Faculty of Innovation & Technology,Taylor's University,Subang Jaya,47500,Selangor,Malaysia

Faculty of Mechanical Engineering & Technology,Universiti Malaysia Perlis(UniMAP),Pauh Putra Campus,02600 Arau,Perlis,Malaysia

Lee Kong Chian Faculty of Engineering and Science,Universiti Tunku Abdul Rahman,Jalan Sungai Long,Bandar Sungai Long,43000 Kajang,Selangor,Malaysia

关键词：

无铅焊料界面显微组织金属间化合物层厚度剪切强度位错密度 ZrO2纳米颗粒 Mo纳米颗粒

出版年：

2024

DOI：

10.1016/S1003-6326(24)66564-7

中国有色金属学报(英文版)

中国有色金属学会

中国有色金属学报(英文版)

CSTPCD

影响因子：1.183

ISSN：1003-6326

年,卷(期)：2024.34(8)