首页|烧结温度和保温时间对Li1.5Ga0.5Ti1.5(PO4)3快离子导体电解质结构和性能的影响

烧结温度和保温时间对Li1.5Ga0.5Ti1.5(PO4)3快离子导体电解质结构和性能的影响

扫码查看
Li1.5Ga0.5Ti1.5(PO4)3(LGTP)被认为是一种很有前途的锂离子固态电解质材料.在不同工艺条件下制备LGTP固体电解质材料,探讨烧结温度和保温时间对材料相对密度、相组成、微观结构、体积电导率和总电导率的影响.在阻抗测试频率1~106Hz范围内,样品的体积电导率随烧结温度的升高而增加,总电导率先增加后降低.SEM结果表明,晶粒大小受温度控制,平均晶粒尺寸从750 ℃时的(0.54±0.01)μm增大到950 ℃时的(1.21±0.01)μm.随着孔隙率的增加,陶瓷样品的相对密度随温度升高而增加,然后降低.保温时间对晶粒尺寸增长或样品密度影响不大,但延长保温时间会导致裂纹产生,从而降低固体电解质的导电性.
Effect of sintering temperature and holding time on structure and properties of Li1.5Ga0.5Ti1.5(PO4)3 electrolyte with fast ionic conductivity
Li1.5Ga0.5Ti1.5(PO4)3(LGTP)is recognized as a promising solid electrolyte material for lithium ions.In this work,LGTP solid electrolyte materials were prepared under different process conditions to explore the effects of sintering temperature and holding time on relative density,phase composition,microstructure,bulk conductivity,and total conductivity.In the impedance test under frequency of 1-106Hz,the bulk conductivity of the samples increased with increasing sintering temperature,and the total conductivity first increased and then decreased.SEM results showed that the average grain size in the ceramics was controlled by the sintering temperature,which increased from(0.54±0.01)μm to(1.21±0.01)μm when the temperature changed from 750 to 950 ℃.The relative density of the ceramics increased and then decreased with increasing temperature as the porosity increased.The holding time had little effect on the grain size growth or sample density,but an extended holding time resulted in crack generation that served to reduce the conductivity of the solid electrolyte.

sintering temperatureholding timeconductivitycrackssolid-state electrolyte

罗银易、梁皓璋、张平、韩磊、张骞、刘李丹、罗志伟、宁天翔、卢安贤

展开 >

中南大学材料科学与工程学院,长沙 410083

江西理工大学材料科学与工程学院,赣州 341000

烧结温度 保温时间 电导率 裂纹 固态电解质

National Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaNational Natural Science Foundation of China

516723105127228851972344

2024

中国有色金属学报(英文版)
中国有色金属学会

中国有色金属学报(英文版)

CSTPCD
影响因子:1.183
ISSN:1003-6326
年,卷(期):2024.34(9)
  • 1