首页|挤压过程中AA6xxx铝合金型材的再结晶行为模拟

挤压过程中AA6xxx铝合金型材的再结晶行为模拟

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介绍了一种开发AA6063铝合金再结晶模型的创新方法.该方法结合了基于回归分析的材料常数测定技术,并引入了评估晶粒尺寸演变的新方程.该方法的校准和验证结合了从3种AA6063铝合金型材的挤压实验中获得的显微组织数据和使用Qform Extrusion UK有限元代码模拟的结果.结果表明,显微组织演化的实验结果与数值模拟的预测结果相吻合.该方法准确模拟了动态再结晶和静态再结晶后晶粒尺寸随不同工业参数变化的趋势,在几乎整个抽样计算中,误差都小于25％.
Modeling of recrystallization behaviour of AA6xxx aluminum alloy during extrusion process
An innovative approach was introduced for the development of a AA6063 recrystallization model.This method incorporated a regression-based technique for the determination of material constants and introduced novel equations for assessing the grain size evolution.Calibration and validation of this methodology involved a combination of experimentally acquired microstructural data from the extrusion of three different AA6063 profiles and results from the simulation using the Qform Extrusion UK finite element code.The outcomes proved the agreement between experimental findings and numerical prediction of the microstructural evolution.The trend of the grain size variation based on different process parameters was accurately simulated,both after dynamic and static recrystallization,with an error of less than 25％in almost the whole sampling computations.

recrystallization simulationaluminum alloy extrusionfinite element methodmicrostructure prediction

Marco NEGOZIO、Antonio SEGATORI、Riccardo PELACCIA、Barbara REGGIANI、Sara Di DONATO、Lorenzo DONATI

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University of Parma-Department of Engineering and Architecture,Parco Area delleScienze,181/A,43124 Parma,Italy

Hydro,Innovation and Technology,Myrkärrsvägen 1,612 31 Finspång,Sweden

DISMI Department of Sciences and Methods for Engineering,University of Modena and Reggio Emilia,Via Amendola 2,42122,Reggio Emilia,Italy

InterMech-MO.RE-University of Modena and Reggio Emilia,Piazzale Europa 1,Reggio Emilia 42124,Italy

DIN Department of Industrial Engineering-University of Bologna,Viale Risorgimento 2,40136,Bologna,Italy

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再结晶模拟 铝合金挤压 有限元法 显微组织预测

2024

10.1016/S1003-6326(24)66600-8

中国有色金属学报(英文版)
中国有色金属学会

中国有色金属学报(英文版)

CSTPCD
影响因子：1.183
ISSN：1003-6326
年,卷(期)：2024.34(10)