The thermal conductivity of Cu/Kovar composites was improved by suppressing element diffusion at the interfaces through the formation of FeWO4 coating on the Kovar particles via vacuum deposition.Cu matrix composites reinforced with unmodified(Cu/Kovar)and modified Kovar(Cu/Kovar@)particles were prepared by hot pressing.The results demonstrate that the interfaces of Cu/FeWO4 and FeWO4/Kovar in the Cu/Kovar@composites exhibit strong bonding,and no secondary phase is generated.The presence of FeWO4 impedes interfacial diffusion within the composite,resulting in an increase in grain size and a decrease in dislocation density.After surface modification of the Kovar particle,the thermal conductivity of Cu/Kovar@composite is increased by 110％from 40.6 to 85.6 W·m-1·K-1.Moreover,the thermal expansion coefficient of the Cu/Kovar@composite is 9.8×10-6K-1,meeting the electronic packaging requirements.
万方数据