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电子封装高温焊料研究新进展

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随着先进封装和第三代半导体的快速发展,具有高熔化温度、耐持久温度考验的高温焊料逐渐成为学界追逐的热点,也成为推动电子产业无铅化和升级换代等"卡脖子"问题的瓶颈.本文综述了传统高温Sn-80Au和Pb-Sn焊料、IMC焊料、纳米及纳米-微米混合焊料,提出未来高温焊料在成分上必将以金、银、铜、铝等金属或石墨烯、碳纳米管等轻质、高导热、高熔化温度的碳基材料及其复合材料为主流;在微观尺度上,纳-微米混合焊料既具有纳米焊料的温度效应,又具有颗粒选择的灵活性,能在一定程度上解决纳米焊料的氧化、团聚及烧结时的相转变等问题;基于颗粒焊料的多尺度、颗粒种类选择的多维度,具有低温快速制备、高温长期服役的IMC高温焊料也具有极大的前途.加速高温焊料研发,突破低温封装、高温服役的技术瓶颈,必将极大推动先进封装和功率封装的快速发展.
New progress of high temperature solder in electronic packaging
With the quick development of advanced packaging and third-generation semiconductors,high-temperature solder with high melting temperature and long-lasting temperature test has gradually become a hot spot of research,and also become a bottleneck to promote lead-free and upgrade the electronics industry and other"neck"problems.Traditional high-temperature with Sn-80Au and Pb-Sn solders,IMC solders,nano and nano-micron hybrid solders were summarized.It is proposed that high-temperature solders will definitely be dominated by gold,silver,copper,aluminum and other metals in terms of composition or graphene,carbon nanotubes and other lightweight,highly thermally conductive,high melting temperature carbon-based materials and their composites in the future.On the microscopic scale,nano-micron hybrid solder has the temperature effect of nano-solder and the flexibility of particle selection,which can solve the problems of oxidation,agglomeration and phase transition of nano-solder during sintering to a certain extent.Based on the multi-scale of particle solder and the multi-dimensional selection of particle types,IMC high-temperature solder with rapid preparation at low temperatures and long-term service at high temperatures also holds great promise.Accelerating the development of high-temperature solder,breaking through the technical bottleneck of low-temperature packaging and high-temperature service,will greatly promote the rapid development of advanced packaging and power packaging.

electronic packaginghigh temperature solderhigh thermal conductivitynano-micron hybrid solderIMC solder

马勇冲、甘贵生、罗杰、张嘉俊、陈嗣文、李方樑、李乐奇、程大勇、吴懿平

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重庆理工大学 重庆特种焊接材料与技术高校工程技术研究中心,重庆 400054

金龙精密铜管集团股份有限公司,重庆 404000

华中科技大学 材料科学与工程学院,武汉 430074

电子封装 高温焊料 高导热率 纳-微米混合焊料 IMC焊料

国家自然科学基金国家自然科学基金中国博士后科学基金面上项目重庆市教委科技项目重点重大项目重庆市教委科技项目重点重大项目

62274020619740132022MD713756KJZD-K202101101KJZD-M202301102

2024

10.11817/j.ysxb.1004.0609.2023-44349

中国有色金属学报
中国有色金属学会

中国有色金属学报

CSTPCD北大核心
影响因子：1.108
ISSN：1004-0609
年,卷(期)：2024.34(2)
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