电子封装高温焊料研究新进展
New progress of high temperature solder in electronic packaging
马勇冲 1甘贵生 2罗杰 1张嘉俊 1陈嗣文 1李方樑 1李乐奇 3程大勇 3吴懿平4
作者信息
- 1. 重庆理工大学 重庆特种焊接材料与技术高校工程技术研究中心,重庆 400054
- 2. 重庆理工大学 重庆特种焊接材料与技术高校工程技术研究中心,重庆 400054;金龙精密铜管集团股份有限公司,重庆 404000
- 3. 金龙精密铜管集团股份有限公司,重庆 404000
- 4. 华中科技大学 材料科学与工程学院,武汉 430074
- 折叠
摘要
随着先进封装和第三代半导体的快速发展,具有高熔化温度、耐持久温度考验的高温焊料逐渐成为学界追逐的热点,也成为推动电子产业无铅化和升级换代等"卡脖子"问题的瓶颈.本文综述了传统高温Sn-80Au和Pb-Sn焊料、IMC焊料、纳米及纳米-微米混合焊料,提出未来高温焊料在成分上必将以金、银、铜、铝等金属或石墨烯、碳纳米管等轻质、高导热、高熔化温度的碳基材料及其复合材料为主流;在微观尺度上,纳-微米混合焊料既具有纳米焊料的温度效应,又具有颗粒选择的灵活性,能在一定程度上解决纳米焊料的氧化、团聚及烧结时的相转变等问题;基于颗粒焊料的多尺度、颗粒种类选择的多维度,具有低温快速制备、高温长期服役的IMC高温焊料也具有极大的前途.加速高温焊料研发,突破低温封装、高温服役的技术瓶颈,必将极大推动先进封装和功率封装的快速发展.
Abstract
With the quick development of advanced packaging and third-generation semiconductors,high-temperature solder with high melting temperature and long-lasting temperature test has gradually become a hot spot of research,and also become a bottleneck to promote lead-free and upgrade the electronics industry and other"neck"problems.Traditional high-temperature with Sn-80Au and Pb-Sn solders,IMC solders,nano and nano-micron hybrid solders were summarized.It is proposed that high-temperature solders will definitely be dominated by gold,silver,copper,aluminum and other metals in terms of composition or graphene,carbon nanotubes and other lightweight,highly thermally conductive,high melting temperature carbon-based materials and their composites in the future.On the microscopic scale,nano-micron hybrid solder has the temperature effect of nano-solder and the flexibility of particle selection,which can solve the problems of oxidation,agglomeration and phase transition of nano-solder during sintering to a certain extent.Based on the multi-scale of particle solder and the multi-dimensional selection of particle types,IMC high-temperature solder with rapid preparation at low temperatures and long-term service at high temperatures also holds great promise.Accelerating the development of high-temperature solder,breaking through the technical bottleneck of low-temperature packaging and high-temperature service,will greatly promote the rapid development of advanced packaging and power packaging.
关键词
电子封装/高温焊料/高导热率/纳-微米混合焊料/IMC焊料Key words
electronic packaging/high temperature solder/high thermal conductivity/nano-micron hybrid solder/IMC solder引用本文复制引用
基金项目
国家自然科学基金(62274020)
国家自然科学基金(61974013)
中国博士后科学基金面上项目(2022MD713756)
重庆市教委科技项目重点重大项目(KJZD-K202101101)
重庆市教委科技项目重点重大项目(KJZD-M202301102)
出版年
2024
NETL
NSTL
万方数据