首页|中间层对GH5188高温合金TLP扩散焊接头的影响

中间层对GH5188高温合金TLP扩散焊接头的影响

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通过自主研发制备了三种不同W含量KCo7、KCo8、KCo9中间层,采用X射线衍射仪(XRD)、差示扫描量热仪(DSC)对中间层进行表征,并在1180℃保温60 min的条件下进行GH5188高温合金真空瞬间液相扩散焊试验验证;分别研究了中间层厚度以及不同中间层接头显微结构及力学性能的影响.结果表明:当KCo7中间层厚度为20 μm时,接头存在大量未焊合缺陷,室温抗拉强度仅有568 MPa;当KCo7中间层厚度增加至40 μm时,焊缝填充良好,室温抗拉强度达到941.3 MPa.此外,随着中间层中W含量由0增加至8%(质量分数)时,焊缝中心富W的M6C析出量明显增加,室温抗拉强度先上升后下降.其中,采用厚度为40 μm的KCo8中间层获得的接头具有最高的室温抗拉强度1033 MPa,且断裂发生在母材区.
Effect of interlayer on TLP bonding joint of GH5188 superalloys
Through independent research and development,three kinds of amorphous intermediate layers of KCo7,KCo8 and KCo9 with different W contents were prepared,characterized by X-ray diffractometry(XRD)and differential scanning calorimetry(DSC),and verified through vacuum transient liquid phase bonding of GH5188 superalloys at 1180℃for 60 min.The effects of interlayer thickness and interlayer W content on the microstructure and mechanical properties of the joints were investigated separately.The results show that,when the interlayer thickness is 20 μm,the joint exhibits numerous unwelded defects,resulting in room temperature tensile strength of only 568 MPa.However,when the interlayer thickness increases to 40 μm,the weld fills well,forming and the room temperature tensile strength of 941.3 MPa.Additionally,as the W content in the interlayer increases from 0 to 8%(mass fraction),the precipitation of W-rich M6C in the center of the weld significantly increases,and the room temperature tensile strength initially increases and then decreases.The joints obtained using the KCo8 interlayer with thickness of 40 μm exhibits the highest room temperature tensile strength of 1033 MPa,with fracture occurring in the base material zone.

cobalt-based superalloysTLP bondinginterlayermicrostructuremechanical properties

滕俊飞、周惠焱、李家豪、伍大为、陈伟兼、林铁松、黄永德

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中国航空制造技术研究院 航空焊接与连接航空科技重点实验室,北京 100024

南昌航空大学 航空制造工程学院,南昌 330063

浙江工业大学 化工机械设计研究所,杭州 310014

哈尔滨工业大学 先进焊接与连接国家重点实验室,哈尔滨 150001

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钴基高温合金 TLP扩散焊 中间层 微观组织 力学性能

国防科技重大专项国家自然科学基金哈尔滨工业大学先进焊接与连接国家重点实验室开放基金研究基金

J2019-Ⅶ-001252065048AWJ-22Z02

2024

中国有色金属学报
中国有色金属学会

中国有色金属学报

CSTPCD北大核心
影响因子:1.108
ISSN:1004-0609
年,卷(期):2024.34(2)
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