The tensile deformation of Cu/Ni composite with different grain sizes and the Cr-O-C anti-sticking layer was studied by the molecular dynamics method.The results show that,when the grain size of the Cu/Ni composite is larger than 12 nm,whether the interface contains Cr,O and C atoms or not,the yield strength of the composite increases with the decrease of grain size,which accords with the law of fine grain strengthening.The grain plastic deformation is mainly controlled by dislocation slip inside the crystal and the maximum stress increases by 9.52%.When the grain size is less than 12 nm,the plastic deformation of the tensile process is more controlled by the grain boundary deformation and the yield strength decreases due to the increase of the grain boundary proportion.The Cr-O-C interface weakens the strength of the Cu/Ni composite.With the increase in the number of Cr,O,and C atoms on the interface,the tensile strength of the Cu/Ni composite decreases and the maximum stress decreases by 56.40%.The number of dislocations inside the Cu/Ni composite is also reduced,and the number of Cu atoms transferred to the Ni surface is reduced.
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