高纯铜带耐高温性能的研究进展
Research progress on high temperature resistance of electronic copper strips
刘媛 1林志霖 2张青科 2宋振纶 2钱少平 3许赪2
作者信息
- 1. 宁波大学 材料科学与化学工程学院,宁波 315211;中国科学院 宁波材料技术与工程研究所海洋关键材料重点实验室,宁波 315201
- 2. 中国科学院 宁波材料技术与工程研究所海洋关键材料重点实验室,宁波 315201
- 3. 宁波大学 材料科学与化学工程学院,宁波 315211
- 折叠
摘要
随着5G电子通信、新能源汽车等产业的发展,高纯铜带在电子器件中的应用愈来愈广泛,同时电子器件封装、热沉等技术发展对其提出了苛刻的耐高温性能要求.高纯铜带对杂质控制要求非常严格,不能采用第二相来调控耐高温性能,因此是当前研究的一大难点.本文综述了高纯铜带耐高温性能的最新研究进展,从制备工艺和组织控制两个角度出发,着重探讨了电解、压延、气相沉积制备的高纯铜带高温下晶粒长大机理的研究进展,针对织构和晶界工程对高纯铜带耐高温性能当前存在的问题和解决办法进行了讨论,并对其发展方向进行了展望.
Abstract
With the rapid growth of emerging industries such as 5G electronic communications,electrical vehicles,etc.,pure copper strips have been widely used in electronic devices due to their high electrical and thermal conductivity,whereas the pressing demands are also forwarded on their high temperature resistance for electronic packaging processes.Pure copper strips have to maintain high purity to meet the requirements on high electrical and thermal conductivity,and cannot promote their thermal stability through particle pinning effect,which makes high temperature resistance of pure Cu strips a research nodus.This paper summarizes the recent progress in high temperature resistance of electronic strips of pure copper,and explores high temperature grain growth mechanisms of pure copper strips prepared by electrolysis,vapor deposition,and rolling with a focus on the manufacturing and microstructure control.Meanwhile,this paper discusses the present problems and solutions for high temperature resistance of copper strips in the view of texture control and grain-boundary engineering,and proposes the prospective research topics of the copper strips.
关键词
高纯铜带/耐高温性能/晶粒长大/组织/进展Key words
pure copper strips/high temperature resistance/grain growth/microstructure/progress引用本文复制引用
基金项目
宁波市科技创新重大项目(2025)(2021Z118)
河南省中国科学院科技成果转移转化项目(2023105)
Ningbo Major Project of Science and Technology Innovation,China(2025)()
Henan Scientific and Technological Achievements Transfer and Transformation Project of Chinese Academy of Sciences()
出版年
2024
NETL
NSTL
万方数据