流固耦合气动巨量转移技术薄膜形变研究
Study on Film Deformation of Flow-Solid Coupling Pneumatic Mass Transfer Technology
刘杨波 1徐杰 2刘强2
作者信息
- 1. 国家电光源质量监督检验中心(北京),北京 100022
- 2. 北京石油化工学院精密电磁装备与先进测量技术研究所,北京 102617
- 折叠
摘要
针对现有芯片转移技术良率低,速度慢的问题,本文研究了一种高效的Mini/Micro LED芯片大规模转移技术——气动巨量转移技术.该方法使用微孔气针喷射稳定气流引发薄膜凸起形变,实现对LED芯片的精准快速转移.文中利用流固耦合仿真进行了关键参数的研究和优化,包括薄膜的物理性质、扩张程度.仿真结果显示,调整薄膜的弹性模量和扩张程度可以显著优化转移过程中的薄膜凸起形态,从而提高转移精度.实验验证表明,使用弹性模量28.2 MPa、泊松比0.32、薄膜扩张量40 mm条件下的薄膜进行转移测试,转移精度可以达到±15 μm.本技术的提出为Mini/Micro LED显示屏的高质量生产提供了潜在解决方案.
Abstract
Aiming at the problems of low yield and low efficiency of the existing chip transfer technology,an efficient large-scale transfer technology of Mini/Micro LED chip—pneumatic mass transfer technology is studied in this paper.The method uses microporous gas needle injection to stabilize the air flow and cause the film protrusion deformation to realize the accurate and fast transfer of the LED chip to the target substrate.In this paper,fluid-structure coupling simulation is used to study and optimize the key parameters,including the physical properties and expansion degree of the film.The simulation results show that adjusting the elastic modulus and expansion degree of the film can significantly optimize the morphology of the film during the transfer process,thus improving the transfer precision.The experimental results show that the transfer accuracy can reach±15μm when the elastic modulus is28.2 MPa,the Poisson ratio is0.32 and the film expansion is40 mm.The proposed technology provides a potential solution for the high-quality production of Mini/Micro LED displays.
关键词
Mini/Micro/LED/巨量转移技术/薄膜/流固耦合Key words
Mini/Micro LED/massive transfer/films/fluid-structure interaction引用本文复制引用
基金项目
北京市自然科学基金面上项目资助(3212004)
北京市属高等学校高水平科研创新团队建设支持计划项目(BPHR20220110)
北京市属高校分类发展项目(11000023T000002199202)
出版年
2024
NETL
NSTL
万方数据