Design and Optimization of Heat Dissipation Device Based on High-Power LED Lamps
This paper aims to optimize the design of the heat dissipation device for indoor high-power LED lamps.A new type of heat dissipation system is constructed by using nano-carbon copper composite materials,dendritic fractal structures,and liquid metal heat dissipation interfaces.Through ANSYS Fluent simulation and experimental verification,the influences of heat dissipation materials,structures,and interfaces on the junction temperature of LEDs are studied.The results show that the optimized design can reduce the junction temperature of LEDs by 24.4℃,reduce the thermal resistance of the heat sink by 41.8%,and increase the luminous flux by 8.7%.The research results provide new ideas for the heat dissipation design of high-power LED lamps and help improve the performance and reliability of LED lamps.
LED lightingheat dissipationcarbon copper composite materialfractal structure
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