倒装LED晶片在全彩Mini LED显示屏中的精确组装与校正技术研究
Research on Precision Assembly and Calibration Technology for Inverted LED Chip in Full Color Mini LED Display Panel
张妮1
作者信息
- 1. 深圳市聚飞光电股份有限公司,广东 深圳 518100
- 折叠
摘要
本文旨在通过倒装LED晶片转移封装工艺、行列驱动电路设计、高精度拼装结构和整屏校正技术等研究,开发倒装COB高清小间距无缝拼接LED显示屏.通过解决关键技术问题,实现了显示屏的开发.该显示屏具有黑屏墨色一致性、白屏各视角一致性、整屏一致性以及高焊接良率等优点.行列驱动电路设计采用列恒流芯片+行驱动芯片,达到了低功耗、高表面温度控制和低灰效果;精确的拼装结构设计实现了高精度平整度和快速安装更换;校正技术解决了亮度和色彩一致性问题.该研究成果为倒装COB高清小间距无缝拼接LED显示屏的开发提供了技术路线和解决方案,将会进一步推动LED显示屏技术的发展,提升用户体验.
Abstract
The purpose of this research is to develop flip-chip COB high definition small pitch seamless spliced LED display.The research contents include flip-chip LED transfer packaging technology,row-and-row drive circuit design,high-precision assembly structure and whole-screen correction technology.By solving the key technical problems,the development of the display screen is realized.In this paper,flip-chip COB technology is used to realize LED wafer stabilization and high yield welding.The design of row-column driving circuit adopts column constant current chip+Row driving chip to realize low power consumption,high surface temperature control and low ash effect.Accurate assembly structure design to achieve high-precision flatness and rapid installation and replacement.The calibration technique solves the problem of brightness and color consistency.The research results provide a technical route and solution for the development of flip-chip COB high definition and small pitch seamless spliced LED display.The display screen has many advantages,will promote the development of LED display technology,enhance the user display experience.
关键词
小间距/无缝拼接/显示屏/转移封装工艺/行列驱动/拼装结构/校正技术Key words
small gap/seamless splicing/display screen/transfer packaging process/row and column drive/assembly structure/calibration technology引用本文复制引用
出版年
2024
NETL
NSTL
万方数据