Research on Precision Assembly and Calibration Technology for Inverted LED Chip in Full Color Mini LED Display Panel
The purpose of this research is to develop flip-chip COB high definition small pitch seamless spliced LED display.The research contents include flip-chip LED transfer packaging technology,row-and-row drive circuit design,high-precision assembly structure and whole-screen correction technology.By solving the key technical problems,the development of the display screen is realized.In this paper,flip-chip COB technology is used to realize LED wafer stabilization and high yield welding.The design of row-column driving circuit adopts column constant current chip+Row driving chip to realize low power consumption,high surface temperature control and low ash effect.Accurate assembly structure design to achieve high-precision flatness and rapid installation and replacement.The calibration technique solves the problem of brightness and color consistency.The research results provide a technical route and solution for the development of flip-chip COB high definition and small pitch seamless spliced LED display.The display screen has many advantages,will promote the development of LED display technology,enhance the user display experience.
small gapseamless splicingdisplay screentransfer packaging processrow and column driveassembly structurecalibration technology
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