摘要
LED灯是一种使用LED作为发光元件的照明设备,具有节能、寿命长等优点.因此,在现代照明领域得到了广泛的应用,为了保护LED灯的内部结构,提高其耐用性和防水性能,LED灯表面常常需要进行封胶处理.同时,随着MINI-LED的兴起,高黏度、高频、微量、高一致性、高精度的点胶需求也随之产生,目前在点胶领域广泛使用的技术有:时间压力式、活塞泵式、螺旋泵式和喷射式点胶,本文将对以上几种点胶技术逐一介绍.本文首先阐述了论文的研究背景和目的,其次介绍了LED封装点胶技术的应用领域和未来LED封装点胶技术将面临微量化、自动化、智能化三大技术挑战,随后介绍了目前广泛应用的时间压力式、活塞泵式、螺旋泵式和喷射式这4种点胶方式的原理及优劣势,最后解释了点胶工艺发展如此迅速的原因,并介绍了未来的发展方向.
Abstract
LED lights are a type of lighting equipment that uses LEDs as luminous elements,with advantages such as energy conservation and long lifespan.Therefore,they have been widely used in the modern lighting field.In order to protect the internal structure of LED lights,improve their durability and waterproof performance,the surface of LED lights often needs to be sealed.At the same time,with the rise MINI-LED,there is a demand for high viscosity,high-frequency,trace,high consistency,and high-precision dispensing.Currently,the widely used technologies in the dispensing field include:time pressure dispensing,piston pump dispensing,screw pump dispensing,and jet dispensing.This article will introduce each of the above dispensing technologies one by one.This article first elaborates on the research background and purpose of the paper,and then introduces the application fields of LED packaging dispensing technology and the three major technological challenges that LED packaging dispensing technology will face in the future:miniaturization,automation,and intelligence. Then,it introduces the principles,advantages and disadvantages of four widely used dispensing methods:time pressure,piston pump,screw pump,and jet dispensing,finally,explains why the dispensing process has developed so rapidly and introduces the direction of future development.
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