首页|基于视觉的芯片位姿测量方法研究

基于视觉的芯片位姿测量方法研究

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针对芯片贴装过程中的偏移检测问题,提出一种基于视觉的芯片位姿测量方法.该方法首先对获取的芯片图像进行预处理;在获取像素级边缘的基础上,根据像素点灰度值,利用Sigmoid函数进行分类,准确定位芯片亚像素边缘,并对边缘异常点进行校正;最后,由已知的芯片尺寸对图像中的连通域进行计数,得到图像中的芯片个数,并通过重心坐标将芯片亚边缘划分为 4 个区域,采用最小二乘法分别进行拟合,获得芯片的位姿信息.实验结果表明,该方法具有一定的鲁棒性,且定位精度在0.5 pixel以内,运行时间约为0.4 s,满足实际生产中的贴装要求,具有一定的使用价值.
Research on Vision-Based Chip Pose Measurement Method
Aiming at the problem of chip offset detection during chip mounting,a vision-based chip pose measurement method is proposed.Firstly,the chip image is preprocessed.On the basis of pixel level edge,according to the gray value of pixel point,Sigmoid function is used to classify the chip sub-pixel edge accu-rately,and the edge outliers were corrected.Finally,the number of chips in the image is obtained by count-ing the connected components in the image according to the known chip size,the number of chips in the image is determined,and the chip sub-pixel edge is divided into four areas by the center of gravity coordi-nates,and the least square method is used to fit sub-pixel edge respectively,the pose information of the chip was obtained.The experimental results show that the method has certain robustness,and the positioning ac-curacy is less than 0.5 pixel,and the running time is about 0.4 s,which meets the requirements of mount-ing in actual production and has certain application value.

vision detectionchip localizationsub-pixel edge locationSigmoid functionoutlier correction

冉迪、王宁、李松珍、王丹、韩志、王晓凤

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沈阳城市建设学院机械工程学院,沈阳 110167

沈阳工业大学 机械工程学院,沈阳 110870

沈阳工业大学 工程实训中心,沈阳 110870

视觉检测 芯片定位 亚像素边缘 Sigmoid函数 异常点校正

国家自然科学基金辽宁省教育厅科学研究经费项目辽宁省教育厅基本科研项目

52275455LJKZ0160JYTMS20231543

2024

组合机床与自动化加工技术
大连组合机床研究所 中国机械工程学会生产工程分会

组合机床与自动化加工技术

CSTPCD北大核心
影响因子:0.671
ISSN:1001-2265
年,卷(期):2024.(2)
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