Study on Ultrasonic Vibration Assisted Grinding Force of 2.5D-C/SiC Composite
To study the removal mechanism of ultrasonic vibration assisted grinding 2.5D-C/SiC compos-ites and the effect of grinding force,firstly,the removal mechanism of 2.5D-C/SiC matrix,latitudinal fi-ber,meridional fiber and nailing part was analyzed by experiments;Then the main and secondary effects of grinding process parameters(spindle speed ns,feeding rate vw,grinding depth ap and ultrasonic amplitude A)on normal and tangential grinding forces were analyzed through orthogonal tests;Finally,the influence of grinding parameters on normal and tangential grinding forces was analyzed by single factor test.The ex-perimental results show that the removal of materials is a combination of matrix fragmentation,fiber frac-ture,fiber pulling out,interface debonding and other factors;The main and secondary effects of normal grinding force:ap>vw>ns>A;The main and secondary influences of tangential grinding force:vw>ap>ns>A;The grinding force is inversely proportional to ns and A,and proportional to ap and vw.
grindingultrasonic vibration assisted grindinggrinding forceinfluence law of grinding force2.5D-C/SiC composites
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