Research on the Material Removal Mechanism of SiCp/Al Based on Single Grain Grinding
Based on the simulation and experiment of single abrasive grinding,the removal mechanism of SiCp/Al composites was studied,and the surface/subsurface quality of SiCp/Al materials with volume fraction of 20%and 55%was compared.By establishing a finite element simulation model of single abra-sive grinding SiCp/Al material,the material removal process is simulated,and the influence of different grinding depths on surface/subsurface quality is studied.The accuracy of the simulation results is verified by the single abrasive grinding experiment,and the surface morphology of SiCp/Al materials with volume fractions of 20%and 55%respectively is deeply studied,and the removal methods of Al matrix and SiC particles are analyzed.In addition,the plastic removal conditions of SiC particles are also discussed.Final-ly,the removal mechanism of the material was further studied by analyzing the morphology of the debris.
SiCp/Al compositessingle grain grindingmaterial removal mechanismfinite element simula-tionsurface/subsurface quality
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维普
