Structural Design and Analysis of High-Speed and High-Precision Micro Motion Stage for Wire Bonding
The flexible micro motion stage driven by piezoelectric ceramics plays an important role in the field of high-speed and precision positioning.Aiming at the problem that the solder head will produce over-shoot impact on the chip and reduce the quality of the chip in the process of wire bonding,this paper puts forward the overshoot of the solder head compensation principle based on the micro motion table driven by piezoelectric ceramics,and designs a unique high-speed and high-precision micro motion table based on the composite structure of spring amplification mechanism.The theoretical analysis and finite element analysis of the micro stage show that the amplification ratio of the micro stage is 4.02 times and the first-order natu-ral frequency is 683.57 Hz.The return speed of the micro platform with spring is 100％ higher than that without spring μs.The effectiveness of the composite structure of spring amplification mechanism is con-firmed.Finally,an experimental system is built to verify the performance of the micro motion platform.It is obtained that the actual magnification of the platform is 3.6 times and has excellent signal tracking perform-ance.The micro motion table meets the requirements of high-speed and high-precision positioning.
wirebondinghigh-speedhigh precisionfinite element analysis
万方数据
维普
