Material Removal Mechanism Based on Circumferential Spacing Stress Interference of SiC Multi-Abrasive Grits
In order to solve the problem that it is difficult to select the appropriate grinding wheel concentra-tion in silicon carbide grinding process,the finite element numerical simulation study of SiC material removal under the influence of abrasive grits distribution spacing was carried out.Firstly,according to the distribution characteristics of abrasive grits on the grinding wheel,the variation range of circumference spacing was deter-mined.Confirm the circumferential spacing parameters of abrasive grits with corresponding particle size and establish the finite element model of multi-abrasive grits scratching.Then analyse the surface morphology,subsurface crack propagation and stress distribution characteristics under different circumferential spacing of abrasive grits to reveal the effect mechanism of circumferential spacing on SiC material removal during grind-ing process.Finally,the function relationship of "grinding wheel concentration-volume fraction-circumferen-tial spacing" was constructed,and a method of grinding wheel concentration selection based on the circumfer-ential distribution of abrasive grits was proposed.The results of this study can provide scientific basis for se-lecting the grinding wheel concentration in SiC grinding process,so as to obtain the SiC grinding technology with high quality surface morphology,low sub-surface damage and uniform processing.
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