首页|Phase-field lattice-Boltzmann study on fully coupled thermal-solute-convection dendrite growth of Al-Cu alloy

Phase-field lattice-Boltzmann study on fully coupled thermal-solute-convection dendrite growth of Al-Cu alloy

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Dendrite growth is a complex liquid-solid phase transition process involving multiple physical factors.A phase-field lattice-Boltzmann method was developed to simulate the two-and three-dimension dendrite growth of Al-Cu alloy.The effect of fully coupled thermal-solute-convection interaction on the dendrite growth was investigated by incorporating a parallel-adaptive mesh refinement algorithm into the numerical model.By accurately reproducing the latent heat release,solute diffusion and convective transport behaviors at the liquid-solid interface,the interaction mechanism among thermal-solute-convection transport as well as their coupling effects on the dendrite growth dynamics were discussed.The simulation results show that the release of latent heat slows down the dendrite growth rate,and both natural and forced convection disrupt the symmetrical growth of dendrites.Their combination makes the growth of dendrites more complex,capturing important physical aspects such as recalescence,dendrite tip splitting,dendrite tilting,dendrite remelting,and solute plume in the simulation case.Based on the robustness and powerful ability of the numerical model,the formation mechanisms of these physical aspects were revealed.

simulationphase fielddendrite growththermal-solute-convection interaction

Yin-qi Qiu、Meng-wu Wu、Xun-peng Qin、Shou-mei Xiong

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Hubei Key Laboratory of Advanced Technology for Automotive Components,Wuhan University of Technology,Wuhan 430070,China

Hubei Longzhong Laboratory,Xiangyang 441000,Hubei,China

School of Materials Science and Engineering,Tsinghua University,Beijing 100084,China

National Natural Science Foundation of ChinaKey R&D Program of Hubei Province,ChinaKey R&D Program of Hubei Province,ChinaOpen Fund of Hubei Longzhong Laboratory,China

522753702022BAD1002021BAA0482022ZZ-04

2024

10.1007/s41230-024-3127-5

中国铸造
沈阳铸造研究所

中国铸造

CSTPCDEI
影响因子：0.299
ISSN：1672-6421
年,卷(期)：2024.21(2)
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