为适应高频通信技术发展需求,制备出综合性能优异的纸基覆铜板,聚酰亚胺(PI)纤维由于具有耐高低温、绝缘、阻燃、强化学稳定性等优异的综合性能正逐渐受到关注.本文以PI树脂作为胶黏剂,玻纤布、对位芳纶纸以及PI纤维原纸分别作为增强材料,采用相同制备工艺条件,探究了采用不同增强材料、相同树脂制备的覆铜板的机械性能、介电性能以及热学性能.结果发现,PI纸基覆铜板的最佳特征固化温度条件为89℃、131℃、166℃.热压工艺为:第一阶段:89℃/30mi n/10M P a;第二阶段:131℃/60min/15MPa;第三阶段:166℃/30min/15MPa;在相同的覆铜板制备工艺下,PI纤维纸制备的PI纸基覆铜板的介电性能和热学性能最好.研究结果拓宽了PI纤维应用领域,也为制备高频高速纸基覆铜板提供了重要的理论指导和技术支撑.
Preparation of Polyimide Paper-Based Copper Clad Laminate and Its Performance Study
The high-quality paper-based copper clad laminate was developed to meet the requirement of high-frequency communication technologies.The remarkable properties of polyimide(PI)fibers,including resistance to high and low temperatures,insulation,flame retardancy,and excellent chemical stability,are drawing more and more attention.In order to investigate the mechanical,dielectric,and thermal properties of copper clad laminate prepared with various reinforcement materials and the same resin,this paper uses PI resin as the adhesive and fibreglass cloth,para-aramid paper,and PI fiber raw paper as reinforcement materials,all prepared under the same conditions.The results showed that the ideal typical curing temperature conditions for PI paper-based copper clad laminates are 89 ℃,131 ℃,and 166 ℃ during the hot pressing process,which consists of phase 1:89 ℃/30 min/10 MPa;phase 2:131 ℃/60 min/15 MPa;phase 3:166 ℃/30 min/15 MPa.Under the same preparation process,PI paper-based copper clad laminates prepared with PI fiber shows the best dielectric and thermal properties.This research broadened the application field of PI fibers and provided important theoretical guidance and technical support for the preparation of high-frequency and high-speed paper-based copper clad laminates.
NETL
NSTL
万方数据
