首页|Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings

Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings

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Ultrasonic vibration grinding differs from traditional grinding in terms of its material removal mechanism.The randomness of grain-workpiece interaction in ultrasonic vibration grinding can produce variable chips and impact the surface roughness of workpiece.However,previous studies used iterative method to calculate the unformed chip thickness(UCT),which has low computational efficiency.In this study,a symbolic difference method is proposed to calculate the UCT.The UCT distributions are obtained to describe the stochastic interaction characteristics of ultrasonic grinding process.Meanwhile,the UCT distribution characteristics under different machining parameters are analyzed.Then,a surface roughness prediction model is established based on the UCT distribution.Finally,the correctness of the model is verified by experiments.This study provides a quick and accurate method for predicting surface roughness in longitudinal ultrasonic vibration grinding.

Ultrasonic vibration grindingUndeformed chip thickness(UCT)Distribution characteristicsSurface roughness

Yanqin LI、Daohui XIANG、Guofu GAO、Feng JIAO、Bo ZHAO

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School of Mechanical and Power Engineering,Henan Polytechnic University,Jiaozuo 454000,China

国家重点研发计划Open Fund Project of Xinchang Research Institute of Zhejiang University of TechnologyFundamental Research Funds for the Universities of Henan Province,China

2018YFB2000402NSFRF200102

2024

10.1631/jzus.A2200609

浙江大学学报(英文版)(A辑:应用物理和工程)
浙江大学

浙江大学学报(英文版)(A辑:应用物理和工程)

CSTPCD
影响因子：0.556
ISSN：1673-565X
年,卷(期)：2024.25(4)
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