Research on Design Method of Liquid Cooled Heater for Vacuum Coating Equipment Based on System Regression Model
The design of wafer heating plate has two core performance indicators:uniformity of working surface temperature and temperature control ability,and the wafer heating plates needs to be verified by multiple simulation iterations and tests before the design is finalized to determine that the product performance meets the design requirements.Based on the finite element calculation and system regression model,this study accurately predicts the actual required length,power density and corresponding layout scheme of the heater,and proposes a method to obtain the optimal solution with temperature uniformity as the goal.The verification results of different schemes show that the accuracy of the model is above 98%,which can greatly improve the design efficiency of heating plate and provide the possibilities for the application of artificial intelligence in the field of heating plate design.In addition,based on the theory of heat transfer,a design method for heating plate temperature control ability is proposed,which guides the design of heating plate temperature control ability through one-dimensional calculation.
semiconductorvacuum coating equipmentwafer heaterwater coolingregression modelthermal control
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