真空与低温2024,Vol.30Issue(1) :31-38.DOI:10.12446/j.issn.1006-7086.2024.01.004

不同摩擦副条件下二硫化钼薄膜的摩擦学性能研究

Tribological Properties of MoS2-Ti Films Sliding Against Different Mating Materials in Dry Sliding

冯兴国 郑玉刚 汪科良 杨拉毛草 张凯锋 周晖
真空与低温2024,Vol.30Issue(1) :31-38.DOI:10.12446/j.issn.1006-7086.2024.01.004

不同摩擦副条件下二硫化钼薄膜的摩擦学性能研究

Tribological Properties of MoS2-Ti Films Sliding Against Different Mating Materials in Dry Sliding

冯兴国 1郑玉刚 1汪科良 1杨拉毛草 1张凯锋 1周晖1
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作者信息

  • 1. 兰州空间技术物理研究所 真空技术与物理重点实验室,兰州 730000
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摘要

为了研究MoS2-Ti薄膜与 9Cr18钢、W-DLC和DLC薄膜的摩擦学行为,分别采用磁控溅射技术和等离子体增强化学气相沉积技术在 9Cr18钢表面沉积了MoS2-Ti薄膜、W-DLC和DLC薄膜.用扫描电子显微镜(SEM)、能量色散谱仪(EDS)和X射线衍射仪(XRD)研究了薄膜的表面形貌、化学成分和相组成.利用纳米压痕仪和球-盘摩擦试验机对不同薄膜的纳米硬度和摩擦学性能进行了分析.研究结果表明,MoS2-Ti薄膜与DLC薄膜的摩擦因数和磨损率最小.相比MoS2-Ti薄膜与不镀膜的 9Cr18钢球摩擦副,MoS2-Ti薄膜与W-DLC薄膜摩擦副的摩擦因数和磨损率没有减小.MoS2-Ti薄膜与W-DLC薄膜摩擦副的磨损机制为磨粒磨损和黏着磨损,与DLC薄膜摩擦副的磨损机制为黏着磨损.摩擦副表面沉积DLC薄膜有助于降低MoS2-Ti薄膜的摩擦因数和磨损率.

Abstract

In order to study the tribological behavior of MoS2-Ti thin films sliding against 9Cr18 steel,W-DLC and DLC thin films,MoS2-Ti,W-DLC and DLC films are deposited on 9Cr18 steel by magnetron sputtering and plasma enhanced chemical vapor deposition technology respetively.The morphology,composition and phase structure of the films are charac-terized by SEM,EDS and XRD.The hardness and tribological properties of MoS2-Ti films sliding against 9Cr18 steel,W-DLC and DLC are investigated by hardness tester and ball-on-disc tribometer respectively.The results show that the MoS2-Ti films sliding against DLC have the lowest friction coefficient and wear rate among these three mating materials.Compared to the MoS2-Ti films sliding against the 9Cr18 ball,MoS2-Ti films and W-DLC film does not reduce the friction coefficient and wear rate.The wear mechanism of MoS2-Ti films and W-DLC is adhesive wear and abrasive wear,while the wear mecha-nism of MoS2-Ti films and DLC is adhesive wear.

关键词

MoS2-Ti薄膜/表面形貌/硬度/摩擦学性能

Key words

MoS2-Ti film/surface morphology/hardness/tribological property

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出版年

2024
真空与低温
中国航天科技集团公司第五研究院510研究所

真空与低温

CSTPCD
影响因子:0.567
ISSN:1006-7086
参考文献量26
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