4～5K铟片填充下无氧铜材料接触热阻实验研究
Experimental Study on Thermal Contact Resistance of Oxygen-free Copper Materials under Indium Sheet Filling at 4～5 K
遆元博 1卫昭夏 1陈志超 2蒋珍华 1刘少帅 1吴亦农 1董德平1
作者信息
- 1. 中国科学院上海技术物理研究所,上海 200083;中国科学院大学,北京 100049
- 2. 中国科学院上海技术物理研究所,上海 200083
- 折叠
摘要
在陆续开展的深空探测任务中,高精度光学探测设备需要长期稳定的深低温工作环境.传热界面由于传热介质的热阻而存在一定的传热温差,为确保设备的工作环境,避免探测效率下降、精度下降和噪声干扰增加等严重后果,对无氧铜和不锈钢两种深低温温区常用的固体导热材料的界面接触热阻进行了实验测试.在真空、4～5.2 K、压力为 3077 N、铟片为填充物的条件下,测量了粗糙度为Ra=3.2的无氧铜接触热阻以及粗糙度为Ra=3.2的不锈钢-无氧铜接触热阻.结果表明:无氧铜界面间接触热阻在 10-5～10-4 m2·K/W量级,且随温度的升高和粗糙度的减小而减小;无氧铜和不锈钢间的接触热阻在10-2 m2·K/W量级.
Abstract
In the successive deep space exploration missions,high-precision optical detection equipment requires a long-term stable cryogenic temperature working environment.The heat transfer interface has a certain heat transfer temperature difference due to the thermal resistance of the heat transfer medium,in order to ensure the working environment of the equip-ment,avoid serious consequences such as detection efficiency loss,accuracy decline and noise interference increase.The in-terfacial thermal contact resistance of two solid thermal conductive materials,oxygen-free copper and stainless steel,was ex-perimentally tested at the deep cryogenic temperature zone.The contact thermal resistance of oxygen-free copper(Ra=3.2)and stainless steel-oxygen-free copper contact thermal resistance(Ra=3.2)were texted under the conditions of vacuum,4～5.2 K,pressure of 3077 N and indium sheet as filler.The results show that the thermal contact resistance between oxygen-free copper interfaces is 10-5～10-4 m2·K/W magnitude,and decreases with the increase of temperature and the decrease of roughness.The contact thermal resistance between oxygen-free copper and stainless steel is in the order of 10-2 m2·K/W magnitude.
关键词
接触热阻/液氦温区/无氧铜/铟/粗糙度Key words
thermal contact resistance/liquid helium temperature zone/oxygen-free copper/In/roughness引用本文复制引用
基金项目
中国科学院百人计划()
国家自然科学基金(51806231)
中国科学院战略性先导专项(XDB35000000)
中国科学院战略性先导专项(XDB35040102)
航空科学基金(ASFC-201924090001)
出版年
2024
NETL
NSTL
万方数据