Experimental Study on Thermal Contact Resistance of Oxygen-free Copper Materials under Indium Sheet Filling at 4～5 K
In the successive deep space exploration missions,high-precision optical detection equipment requires a long-term stable cryogenic temperature working environment.The heat transfer interface has a certain heat transfer temperature difference due to the thermal resistance of the heat transfer medium,in order to ensure the working environment of the equip-ment,avoid serious consequences such as detection efficiency loss,accuracy decline and noise interference increase.The in-terfacial thermal contact resistance of two solid thermal conductive materials,oxygen-free copper and stainless steel,was ex-perimentally tested at the deep cryogenic temperature zone.The contact thermal resistance of oxygen-free copper(Ra=3.2)and stainless steel-oxygen-free copper contact thermal resistance(Ra=3.2)were texted under the conditions of vacuum,4～5.2 K,pressure of 3077 N and indium sheet as filler.The results show that the thermal contact resistance between oxygen-free copper interfaces is 10-5～10-4 m2·K/W magnitude,and decreases with the increase of temperature and the decrease of roughness.The contact thermal resistance between oxygen-free copper and stainless steel is in the order of 10-2 m2·K/W magnitude.
thermal contact resistanceliquid helium temperature zoneoxygen-free copperInroughness
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