首页|基于热电制冷的微流体线性降温特性研究

基于热电制冷的微流体线性降温特性研究

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目前,微流体的精确线性降温是微流控技术在医学和生命科学等领域发展应用过程中面临的难题.为实现微流控芯片目标区域的线性降温,本文设计了基于热电制冷的微流体芯片温度调控系统,通过数值模拟和实验测试,实现了电流、制冷量及微流体温度之间的线性耦合响应.结果表明:常规恒定电流驱动热电制冷器时,微流体样品池降温过程线性度仅为0.598,采用单一函数非稳态电流可显著提升微流体降温的线性度,但在不同时间段仍存在冷量盈余与缺口,无法满足线性降温的精度要求.因此,将多种电流波形耦合获得了实现热电冷却微流体线性降温的非稳态过渡电流机制,最终实现了微流体在-19~26 ℃与24~42 ℃/min之间的线性降温,线性度在0.998 1以上,并通过实验验证了热电冷却微流体线性降温机制的准确性.
Examining the Linear Cooling Characteristics of Microfluid Based on Thermoelectric Refrigeration
Currently,the precise linear cooling of microfluidics remains a challenge in the development and application of microfluidic technology in medicine and life sciences.To realize the linear cooling of the target area on a microfluidic chip,a thermoelectric refrigeration-based temperature control system for microfluidic chips was designed,and linear coupling between the current,cooling capacity,and microfluidic temperature was achieved through numerical simulation and experimental tests.When the thermoelectric cooler was driven by a constant current,the linearity of the cooling process of the microfluidic sample cell was only 0.598.The use of a single-function transient current significantly improved the linearity of microfluidic cooling;however,cold surpluses and inadequacies still existed,which did not meet the accuracy requirements of linear cooling.Finally,a transient current mechanism to realize the linear cooling in microfluidic thermoelectric cooler devices was obtained by coupling a variety of current waveforms.Linear cooling of microfluidic between-19-26 ℃ and 24-42 ℃/min was realized,and the linearity was above 0.998 1.The linear cooling mechanism of the thermoelectric cooler for microfluidic devices was successfully verified by experimental tests.

thermoelectric coolingmicrofluidicslinear coolingcooling ratetransient current

王好卿、孙东方、高才、程文龙、周培、唐景春、朱俊叶、韩雪、张梦飞

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合肥工业大学汽车与交通工程学院 合肥 230009

中国科学技术大学工程科学学院 合肥 230026

热电制冷 微流控 线性降温 降温速率 非稳态电流

国家自然科学基金国家自然科学基金中央高校基本科研业务费专项资金

5200605151876053JZ2021HGTB0093

2024

制冷学报
中国制冷学会

制冷学报

CSTPCD北大核心
影响因子:0.672
ISSN:0253-4339
年,卷(期):2024.45(1)
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