At present,EMC packaging structures are mainly combined with top-mounted LED chips,using gold wire or alloy wire for electrical connections,and silver plating is applied to the surface of the bracket to improve the light efficiency of the device. This study introduces flip-flop eutectic technology into the EMC packaging structure. The flip-flop eutectic LED chip features Sn/Au and Cu/Sn/Au alloy treatments on the chip electrode surfaces,which are then eutectically soldered to an EMC bracket with a highly flat copper surface and silver plating. Additionally,white adhesive is filled around the chip to improve the light output efficiency of the device. Experimental results show that the EMC device with chip electrodes treated with Cu/Sn/Au alloy demonstrates significant improvements in high-temperature aging color drift and chip adhesion force,effectively enhancing the reliability of the EMC packaged device.
万方数据
维普
