中南大学学报(英文版)2023,Vol.30Issue(9) :2919-2933.DOI:10.1007/s11771-023-5470-x

微量掺杂氧化钇对热压烧结碳化硼的影响

Effect of micro-doping yttrium oxide on hot-press sintering of boron carbide

颜巧玲 周志辉 袁铁锤 李瑞迪 徐志伟 高和欣 方浩煜
中南大学学报(英文版)2023,Vol.30Issue(9) :2919-2933.DOI:10.1007/s11771-023-5470-x

微量掺杂氧化钇对热压烧结碳化硼的影响

Effect of micro-doping yttrium oxide on hot-press sintering of boron carbide

颜巧玲 1周志辉 1袁铁锤 1李瑞迪 1徐志伟 1高和欣 1方浩煜1
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作者信息

  • 1. State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China
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摘要

以B4C和纳米级Y2O3为原料,通过热压烧结(HP)制备了致密B4C-Y2O3复合材料,研究微量掺杂Y2O3和烧结温度对B4C复合材料组织及性能的影响,并讨论了碳化硼晶粒生长机理和强韧化机制.结果表明,氧化钇可有效促进碳化硼的烧结,且B4C-1 wt%Y2O3复合材料(烧结温度:2000℃;压力:30 MPa;烧结时间:1 min)性能最佳,其相对密度高达99.6%,弯曲强度为588 MPa,断裂韧性为5.0 MPa·m1/2,与纯碳化硼相比有较大的提升.在B4C-Y2O3复合材料中发现了孪晶和粗大晶等晶粒异常生长的情况,碳化硼的晶粒生长受氧化钇与碳化硼晶界间复杂相互作用的影响.B4C复合材料沿晶断裂和晶间断裂共存,其增韧机理遵循自增韧和孪晶增韧.

Abstract

Dense B4C composites were fabricated by hot-press sintering using B4C and nano-scale yttrium oxide as the raw materials.The effects of Y2O3 content and sintering temperature on the microstructure and mechanical properties of B4C composites were studied.And the grain growth mechanism and the strengthening and toughening mechanism were discussed.B4C-1 wt%Y2O3 composites(sintering temperature:2000℃,pressure:30 MPa,dwell time:1 min)have the best properties,with the relative density of 99.6%,bending strength of 588 MPa and fracture toughness of 5.0 MPa·m1/2.Abnormal grain growth was found in B4C-Y2O3 composites,including twins and coarse grains.The grain growth is affected by the complex interaction of yttrium oxide and the grain boundary of boron carbide.The toughening mechanism of B4C composites follows self-toughening and twinning-toughening,and the transgranular fracture and intergranular fracture coexist.

关键词

碳化硼/氧化钇/热压烧结/晶粒生长

Key words

boron carbide/yttrium oxide/hot-press sintering/grain growth

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基金项目

National Natural Science Foundation of China(51874369)

National Natural Science Foundation of China(52272077)

出版年

2023
中南大学学报(英文版)
中南大学

中南大学学报(英文版)

CSTPCDCSCD北大核心EI
影响因子:0.47
ISSN:2095-2899
参考文献量2
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