Creep properties of bimetal Al/SiC/Cu composites fabricated via accumulative roll bonding process
Basem Ali 1Jasim Dheyaa J. 2Bansal Pooja 3Qasim Maytham T. 4Brisset BJ.5
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作者信息
1. Faculty of Engineering,Warith Al-Anbiyaa University,Karbala 56001,Iraq
2. Department of Petroleum Engineering,Al-Amarah University College,Maysan,Iraq
3. Department of Biotechnology and Genetics,Jain(Deemed-to-be)University,Bengaluru,Karnataka-560069,India;Department of Allied Healthcare and Sciences,Vivekananda Global University,Jaipur,Rajasthan-303012,India
4. College of Health and Medical Technology,Al-Ayen University,Thi-Qar,64001,Iraq
5. Institut des Matériaux Jean Rouxel(IMN),UMR 6502,Polytech'Nantes,Nantes Cedex,France
In the present study,microstructural evolution,mechanical and creep properties of Al/SiC/Cu composite strips fabricated via accumulative roll bonding(ARB)process were studied.The obtained results showed the formation of an atomic diffusion layer with thickness of about 17 μm at the interface during the ARB under three creep loading conditions namely 30 MPa at 225 ℃,35 MPa at 225 ℃,and 35 MPa at 275 ℃.An generated intermetallic compound resulted in a 40％increase of interface thickness near Al.The stress level decreased by 13％at constant temperature with no significant effect on the interface thickness,and the creep failure time declined by 44％.It was observed that at constant temperatures,the second slope of the creep curve reached to 39％with increasing stress level,then,it dropped to 2％with a little temperature rising.After creep test under 35 MPa at 275 ℃,the sample displays the presence of 60％Al and 40％Cu,containing brittle Al2Cu intermetallic compound at the interface.Applied temperature and stress had effect on the creep properties,specially increasing the slope of creep curves with higher stresses.
关键词
蠕变性能/金属间化合物/累积辊压/微观结构/双金属片
Key words
creep property/intermetallic compounds/accumulative roll bonding/microstructure/bimetal
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