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玻璃微珠强化黑曲霉浸出低品位锂云母

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以黑曲霉作为浸矿菌株,添加不同直径、浓度的玻璃微珠对低品位锂云母进行浸出,研究玻璃微珠强化真菌浸矿的机理。将浸出率最高的T1-40与浸出率最低的T5-60进行比较。研究结果表明:小粒径玻璃微珠能提高黑曲霉生物量,促进有机酸分泌,同时对矿石造成机械损伤,进而强化锂的浸出。含菌对照组30 d锂的浸出率为2。53%,而添加玻璃微珠后锂浸出率可达3。19%,使浸出率提高了26%。T1-40的草酸、柠檬酸和葡萄糖酸的质量分数分别增加了62%、11%和25%,而T5-60中柠檬酸质量分数减少了34%。玻璃微珠会对矿石表面进行物理撞击而形成机械损伤。XRD和XPS表明玻璃微珠会加重黑曲霉对矿物结构的破坏。在有机酸作用下金属离子键发生了断裂。本研究有助于理解宏观颗粒与黑曲霉的相互作用,以及玻璃微珠对低品位锂矿浸出的影响。
Glass microspheres-enhanced bioleaching of low grade lepidolite using Aspergillus niger
Using Aspergillus niger as the leaching strain,different diameters and concentrations of glass microspheres were added to leach low-grade lithium mica,and the mechanism by which glass microspheres enhancing fungal leaching was studied. The highest leaching rate T1-40 was compared with the lowest leaching rate T5-60. The results show that small glass microspheres can increase the biomass of Aspergillus niger,promote organic acid secretion,and cause mechanical damage to the ore,thereby enhancing lithium leaching. The lithium leaching rate of the bacterial control group after 30 d is 2.53%,while the lithium leaching rate after adding glass microspheres reaches 3.19%,which increases the leaching rate by 26%. The mass fraction of oxalic acid,citric acid,and gluconic acid in T1-40 increases by 62%,11%,and 25%,respectively,while the citric acid content in T5-60 decreases by 34%. The glass microspheres physically impact the surface of the ore,resulting in mechanical damage. Glass microspheres enhance the damage of Aspergillus niger to mineral structures. Metal ion bonds break under the action of organic acids. This study helps to understand the interaction between macroscopic particles and Aspergillus niger,as well as the influence of glass microspheres on the leaching of low-grade lithium ore.

Aspergillus nigerglass microsphereslow grade lepidoliteenhanced bioleaching

张欣怡、丁聪聪、周宇诚、王霄鹏、段怀钰、许超、赵兴青、陆现彩

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常州大学环境科学与工程学院,江苏常州,213164

南京大学地球科学与工程学院,内生金属矿床成矿机制研究国家重点实验室,江苏南京,210023

黑曲霉 玻璃微珠 低品位锂云母 强化生物浸出

2024

中南大学学报(自然科学版)
中南大学

中南大学学报(自然科学版)

CSTPCD北大核心
影响因子:0.938
ISSN:1672-7207
年,卷(期):2024.55(11)