首页|月球辐射环境致DNA链断裂损伤规律的仿真研究

月球辐射环境致DNA链断裂损伤规律的仿真研究

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月球表面缺乏磁场和大气的保护,其辐射环境长期处于极端恶劣的水平,对探月航天员的健康构成了严重威胁.针对月表面无屏蔽、航天服屏蔽和月面基地屏蔽条件下的空间辐射环境,运用基于蒙特卡洛方法的Geant4-DNA仿真软件,研究了单细胞核内DNA在上述环境下的链断裂损伤规律.结果表明:质子引起的双链断裂比例低于铁离子;无屏蔽状态下,若爆发太阳粒子事件,DNA结构将在短期内受到严重破坏,链断裂总数可达 2×106 个以上,约占细胞核内碱基对总数的0.039%;银河宇宙线环境中,辐射风险主要由长期累计剂量引起,质子凭借更高的通量,拥有了比铁离子更强的DNA破坏效果;但在有屏蔽状态下,DNA结构的损伤状况得到了明显改善,尤其是爆发太阳粒子事件这种极端情况下,最多减少了 99.96%的链断裂数.
Simulation Study on Rules of DNA Strand Breakage Damage Caused by Lunar Radiation Environment
The absence of magnetic field and protective atmosphere on the lunar surface results in an extremely harsh radiation environment which poses a significant threat to the health of lunar astro-nauts.In this article,Geant4-DNA simulation software based on the Monte Carlo method was uti-lized to investigate the patterns of DNA strand break damage within cell nuclei under three different space radiation conditions:unshielded lunar surface,astronaut suit shielding,and lunar base shiel-ding.The simulation results indicated that:The proportion of double-strand breaks caused by pro-tons was lower than that caused by iron ions;In the unshielded condition,in the event of a solar particle event,the DNA structure experienced severe damage within a short period,with a total of over 2 million strand breaks,accounting for approximately 0.039%of the total number of base pairs within the cell nucleus;In the galactic cosmic ray environment,radiation risks were primarily driven by long-term cumulative doses.Protons,with their higher flux,exhibited a stronger DNA damaging effect compared to iron ions;However,under shielded conditions,the damage to the DNA structure was significantly reduced,especially in extreme situations such as solar particle events,where up to 99.96%of strand breaks could be mitigated.

lunar surfacecosmic rayssolar protonsDNA strand breaksradiation damage

贾鑫禹、蔡明辉、杨涛、许亮亮、夏清、韩瑞龙、韩建伟

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中国科学院国家空间科学中心,北京 100190

中国科学院大学航空宇航学院,北京 100049

月表 宇宙线 太阳质子 DNA链断裂 辐射损伤

国家重点研发计划

2020YFC2201300

2024

载人航天
中国载人航天工程办公室

载人航天

CSTPCD北大核心
影响因子:0.411
ISSN:1674-5825
年,卷(期):2024.30(2)
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