首页|Synergistically enhanced dielectric,insulating and thermally conductive performances of sandwich PMMA based dielectric films

Synergistically enhanced dielectric,insulating and thermally conductive performances of sandwich PMMA based dielectric films

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A tri-layered(B-G-B)dielectric films were simply prepared by alternatively spin-coating boron nitride/poly-methylmethacrylate(BN/PMMA,B)and graphene nanosheets(GNS/PMMA,G)compound solutions.The struc-ture,morphology,thermal conductivity,and particularly the dielectric and relaxation behaviors were systematically studied.Results showed that a good exfoliation and dispersion of BN and GNS can be simply achieved through intensive mechanical compounding with PMMA in the internal mixer.The dielectric constant and breakdown strength of the obtained 1-3-1(B-G-B)sandwich composite film reached 4.3(@1 kHz)and 458.6 kV/mm,being 119%and 113%higher than that of pure PMMA,respectively.Furthermore,the overall thermal conductivity of sandwich 1-3-1 composite increased by 112%due to the addition of thermally conductive BN and GNS.The sandwich design strategy provided an effective way of achieving good permittivity,high insulation,and improved thermal conductivity simultaneously,showing potential applications in the miniaturization and inte-gration of electronic devices.

Sandwich structureBreakdown strengthThermal conductivityDielectric constantComposites

Dongmei Zhang、Yufan Li、Yuchao Li、Zhonggui Sun、Hanxue Zhu、Lujia Yang、Yanhu Zhan、Yankai Li、Shi Wang、Jun-Wei Zha

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School of Mathematical Sciences,Liaocheng University,Liaocheng 252059,China

School of Materials Science and Engineering,Liaocheng University,Liaocheng 252059,China

State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials (IAM),Nanjing University of Posts & Telecommunications,9 Wenyuan Road,Nanjing 210023,China

School of Chemistry and Biological Engineering,University of Science and Technology Beijing,Beijing 100083,China

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2024

自然科学进展·国际材料(英文)
国家自然科学基金委员会

自然科学进展·国际材料(英文)

影响因子:0.25
ISSN:1002-0071
年,卷(期):2024.34(3)