氧化锆陶瓷超声辅助磨削材料去除机理试验研究
Experimental study on the material removal mechanism in ultrasonic assisted grinding of zirconia ceramics
崔方方 1丁凯 2刘盛 2李奇林 2何斌2
作者信息
- 1. 江苏理工学院汽车与交通工程学院,江苏 常州 213001
- 2. 江苏理工学院机械工程学院,江苏 常州 213001
- 折叠
摘要
为研究超声振动作用对先进陶瓷磨削材料去除机理的影响,文章在超声振动方向垂直于磨削表面条件下,采用钎焊磨头对氧化锆陶瓷开展了超声辅助磨削(ultrasonic assisted grinding,UAG)试验.基于磨削表面微观形貌、磨削力和磨削比能分析,对变磨削深度条件下普通磨削(conventional grinding,CG)与超声辅助磨削的材料去除机理进行了对比.结果表明:当磨削深度低于 10 μm时,两种方法对应的表面材料去除机理均以塑性去除为主,且普通磨削表面伴有片层状破碎,而超声辅助磨削表面则存在尺寸细小的纹路状微破碎,同时磨削力与磨削比能也较低.当磨削深度超过 10 μm后,材料去除机理均转变为脆性断裂模式,且加工表面出现微裂纹,但相同条件下超声辅助磨削表面微裂纹尺寸较小.
Abstract
In order to study the effect of ultrasonic vibration on the material removal mechanism during grinding of advanced ceramics,the ultrasonic assisted grinding(UAG)test of zirconia ceramics was carried out by brazing grinding head with ultrasonic vibration direction perpendicular to the grinding surface.Based on the analysis of the ground surface micromorphology,grinding force and grinding specific energy,the material removal mechanism of conventional grinding(CG)and UAG under variable grinding depth is compared.The results show that when the grinding depth is less than 10 μm,the material removal mechanism caused by CG and UAG is mainly plastic mode,and the surface produced by CG is accompanied by lamellar fracture,while UAG has smaller grain-like micro fracture.In addition,UAG also caused lower grinding force and grinding specific energy.When the grinding depth exceeds 10 μm,the material removal mechanism is transformed into a brittle fracture mode,and micro-cracks appear on the ground surface,but the size produced by UAG is smaller than CG under the same conditions.
关键词
超声辅助磨削/氧化锆陶瓷/材料去除机理/磨削力/磨削比能Key words
ultrasonic assisted grinding/zirconia ceramics/material removal mechanism/grinding force/specific grinding energy引用本文复制引用
基金项目
江苏省重点研发计划(BE2022106)
江苏省高等学校自然科学研究重大项目(22KJA460004)
出版年
2024
NETL
NSTL
维普
万方数据