Improvement of Corrosion Behavior of the Cu-Ni Alloy with Electroless Ni-P plating

扫码查看

原文链接

NETL
NSTL

外文摘要：The microbiological influenced corrosion (MIC) behavior of the Cu-Ni alloy with or without Ni-P plating in the sterilized medium and sulfate-reducing bacteria (SRB) solution was investigated. Results show that severe pitting corrosion appeared on the uncoated specimens in both the sterilized medium and the SRB solution when the specimens coated with Ni-P plating were still in good condition. Since the Ni-P plating may offer both barrier and cathodic protection to the base-metal. Besides, the structures of Ni-P plating and the passive film on the surface of the Ni-P plating are high uniform and amorphous without any structure defects. The non-crystalline structure may improve the corrosion resistance because it does not have crystalline defects such as dislocation, grain boundary, twin and so on which may cause corrosion easily. It is concluded that corrosion behavior of the Cu-Ni alloy with electroless Ni-P plating was improved greatly.

外文关键词：

microbiological influenced corrosion (MIC)sulfate-reducing bacteria (SRB)Cu-Ni alloyelectroless Ni-P plating

作者：

Li Qing-fen、Fu Yu-dong、Wang Hai-dou、Wang Jun

展开 >

作者单位：

College of Material Science and Chemical Engineering, Harbin Engineering University, College of Mechanical and Electrical Engineering, Harbin Engineering University,Harbin 150001, China

College of Material Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China

National Key Laboratory for Remanufacturing, Armored Forces Engineering Institute,Beijing 100072, China

College of Mechanical and Electrical Engineering, Harbin Engineering University,Harbin 150001, China

展开 >

出版年：

2010

Key engineering materials

ISSN：1013-9826

年,卷(期)：2010.417/418