首页|Crack propagating and stress-promoted the precipitate of Ni_3Ti in NiTi thin films
Crack propagating and stress-promoted the precipitate of Ni_3Ti in NiTi thin films
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This study investigated the stress-induced crack propagation and precipitation in Ti-51.45at.%Ni thin films. Tensile tests were carried out on CSS-44100 electron universal testing machine. The strain rate was 1.1×10~(-4) s~(-1). The surface micrographs of the NiTi thin film were obtained using scanning electron microscopy (SEM). The precipitates were determined by X-ray diffraction (XRD) experiments (D8 GADDS). The results showed that a series of parallel cracks grew in the film and the cracks were equally spaced. The fracture toughness of the film was estimated, K_(Ic)=0.96MPa·m~(1/2). The minimum crack spacing was about 87μm, The stress-strain curve can be divided into two stages. The first linear stage corresponded to the elastic deformation of the parent phase. In the following stage, the serrations were considered to be the stress relaxation due to the cracks propagating and the precipitate grain transformation. During tension the (102) peak intensity of Ni_sTi phase increased with elongation increased. The precipitate orientation was same.
shape memory materialsthin filmdeformation and fractureSEMmartensitic transformation
Y. H. Li、F. L. Meng、W. T. Zheng、Y. M. Wang
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School of Science, National Key Lab. of Technology of AUVs, Harbin Engineering University,Harbin 150001, China
Department of Materials Science, Key Laboratory of Automobile Materials of MOE, Jilin University,Changchun 130012, China
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