首页|Electrical Properties of Conductive Paste with Silver Nanoparticles and Its Application to Flexible Substrates
Electrical Properties of Conductive Paste with Silver Nanoparticles and Its Application to Flexible Substrates
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Silver nanoparticles produced with a solid-phase thermal decomposition method were used for the preparation of a conductive paste supporting curing at low temperatures. The conducting paste was prepared by blending fine spherical silver powder and silver nanoparticles with a diameter of 20nm in order to reduce the electric resistivity of the electrodes. Although the viscosity of the conducting paste increased by about 25% after 60 days, it exhibited superior stability to dispersion in comparison to commercial paste. The electric resistivity of the electrode was of the order of 10~(-6)Ωcm at a curing temperature of 200℃. Using this conducting paste, it is possible to print at widths of 20μm. The resistivity was further reduced by 1% in the high temperature test at 120℃, by 5% in the high humidity and high temperature test, and by 5% during the thermal shock test at temperatures ranging from -45 to 80℃.
Daiken Chemical Co., LTD 7-9 Hanaten-Nishi 2, Joto-ku, Osaka, 536-0011 Japan Graduate School of Fiber Amenity Engineering, University of Fukui, 9-1 Bunkyo 3, Fukui-shi, Fukui, 910-8507 Japan
Graduate School of Fiber Amenity Engineering, University of Fukui, 9-1 Bunkyo 3, Fukui-shi, Fukui, 910-8507 Japan
NETL
NSTL
Trans Tech Publications Ltd
