首页|Synthesis of liquid crystalline epoxy resin p-BDEPB and cure kinetics with 3-MeTHPA

Synthesis of liquid crystalline epoxy resin p-BDEPB and cure kinetics with 3-MeTHPA

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A liquid crystalline epoxy resin of p-biphenylene di-4-(2,3-epoxypropyloxy)benzoate (p-BDEPB) was synthesized from allyl bromide, 4-hydroxy ethyl benzoate and 4,4-dihydroxybiphenyl. Its structure and liquid crystalline behavior were characterized by DSC, 1H-NMR, FTIR, POM and XRD. The results are shown that this compound is smectic liquid crystalline.The melting point of p-BDEPB is 210 ℃ and clearing point is over 300 ℃, the epoxy value is 0.312 mol/100g. The average curing Ea of p-BDEPB/3-methyl-tetrahydrophthalic anhydride (MeTHPA) system is 97.2kJ/mol. The gel point of cured-system T_(gel) is 89.0 ℃, curing temperature T_(cu) is 132.5 ℃ and finishing temperature T_f is 146.5 ℃. The curing reaction can be described by the autocatalytic Sestak-Berggren (S-B) equation, the two reaction orders m and n is 0.23 and 0.74, respectively.

liquid crystallineepoxy resin4,4-dihydroxybiphenylcure kinetics

Jungang Gao、Caiyun Zhang、Li Huo、Yuanyuan Zhang

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College of Chemistry and Environmental Science, Hebei University, Baoding 071002, China

2010

Key engineering materials

Key engineering materials

ISSN:1013-9826
年,卷(期):2010.428/429
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