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Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw
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NSTL
Trans Tech Publications Ltd
The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed V_s and the linear velocity of the wire saws V_w were analyzed.
silicon waferfixed diamond wire saw
Ligang Zhao、Dunwen Zuo、Yuli Sun、Min Wang
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College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China, 210016
NETL
NSTL
Trans Tech Publications Ltd
