首页|Experimental Investigation on Brittle-ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon
Experimental Investigation on Brittle-ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon
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Trans Tech Publications Ltd
Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.
single crystal siliconwire sawbrittle-ductile transitionpartial ductile mode
Yufei Gao、Peiqi Ge
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School of Mechanical Engineering, Shandong University, Jinan, China, 250061
NETL
NSTL
Trans Tech Publications Ltd
