首页|Modeling of Polishing Pad Wear in Chemical Mechanical Polishing
Modeling of Polishing Pad Wear in Chemical Mechanical Polishing
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Trans Tech Publications Ltd
The polishing pad's wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.
CMPpolishing padweartrajectory density
Mao Li、Yongwei Zhu、Jun Li、Kui Lin
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College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics & Astronautics, Nanjing, 210016
NETL
NSTL
Trans Tech Publications Ltd
