首页|Surface/Subsurface Damage of Yttria Partially Stabilized Zirconia in Grinding using Monolayer Brazed Diamond Wheel

Surface/Subsurface Damage of Yttria Partially Stabilized Zirconia in Grinding using Monolayer Brazed Diamond Wheel

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  • NETL
  • NSTL
  • Trans Tech Publications Ltd
A new brazed monolayer diamond grinding wheel is developed with the same continuous cutting edge distance on the wheel surface. Surface/subsurface damage of yttria partially stabilized zirconia (Y-PSZ) in grinding using monolayer brazed diamond wheel is analyzed. In this investigation, the influence of the maximum undeformed chip thickness (h_m) on material removal mechanism is analyzed. The experiment results show that the ground surface is almost in ductile material removal mode when h_m is below the critical value for Y-PSZ, otherwise it will be the combined removal modes of brittle and ductile when h_m is above the critical value.

surface/subsurface damageyttria partially stabilized zirconiagrindingbrazed diamond wheel

Shusheng Li、Jiuhua Xu、Yucan Fu、Honghua Su

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College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, P. R. China, 210016 Department of Mechanical and Electrical Engineering, Taizhou Polytechnic Institute, Taizhou, P. R. China, 225300

College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, P. R. China, 210016

2010

10.4028/www.scientific.net/KEM.431-432.326

Key engineering materials

Key engineering materials

ISSN：1013-9826
年,卷(期)：2010.431/432
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