首页|Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal
Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal
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NETL
NSTL
Trans Tech Publications Ltd
The reaction layer microstructure of SiC/SiC joints brazed by Ag-Cu-Ti filler metal, including composition, morphology, grain size were investigated by X-ray diffraction, electronic probe microanalysis, transmission electron microscope. An obvious reaction layer composed of TiC and Ti_5Si_3 was observed at the interface of SiC substrate and filler metal. There is a representative structure of SiC substrate/continuous fine TiC layer /discontinuous coarse Ti_5Si_3 layer/filler metal in the reaction layer. The continuous TiC layer, composed of about 10 nm roundish grains, is 350 ～400 nm thick. Ti_5Si_3 layer is composed of only one row of Ti_5Si_3 grains, which disperse with diverse size from 100 ～ 500 nm. Different growth behavior of TiC and Ti_5Si_3 is the main reason to form this microstructure.
SiCbrazinginterface microstructure
Yan Liu、Zhengren Huang、Xiujian Liu
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Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
NETL
NSTL
Trans Tech Publications Ltd
