Dimension Accuracy Analysis of a Micro-Punching Mold for IC Packing Bag

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原文链接

NETL
NSTL
Trans Tech Publications Ltd

外文摘要：This article is pointed to the dimension accuracy analysis of the micro-punching mold for plastic carrier tape. The parts' dimensions of the punch were first determined by the specification of the plastic carrier tape. The parts would be manufactured and assembled, and the performance of the punch was tested subsequently. Variation of dimensional accuracy of the plastic carrier tape was inspected to evaluate the performance of the punch. Mean and variance test was conducted under the significance level of a = 0.05. Through these inspections, all the plastic carrier tape met the specifications of dimensional accuracy, which indicated that the precision and performance of the developed micro-punching mold also met the requirement.

外文关键词：

dimension accuracymicro-punching moldIC packing bagplastic carrier tapehypothesis testing

作者：

Wei-Shin Lin、Jui-Chang Lin

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作者单位：

Department of Mechanical and Computer - Aided Engineering, National Formosa University, Huwei, Yunlin, Taiwan

Department of Mechanical Design Engineering, National Formosa University, Huwei, Yunlin

出版年：

2010

DOI：

10.4028/www.scientific.net/KEM.437.477

Key engineering materials

ISSN：1013-9826

年,卷(期)：2010.437

参考文献量5