首页|Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container

Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container

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  • NETL
  • NSTL
  • Trans Tech Publications Ltd
We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.

CMPdouble-side polishingatmospheresilicon wafergas pressureremoval rate

Kei KITAMURA、Toshiro DOI、Syuhei KUROKAWA、Yoji UMEZAKI、Yoji MATSUKAWA、Yota OOKI、Tadashi HASEGAWA、Isamu KOSHIYAMA、Koichiro ICHIKAWA、Yoshio NAKAMURA

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Kyushu University, 744, Motooka, Nishi-ku, Fukuoka, 819-0395, Japan

Koshiyama Science and Technology Foundation, 1-1, Techno-Plaza, Kakamigahara, Gifu, 509-0109, Japan

Fujikoshi Machinery Corp., 1650, Matsushiro-machi, Nagano, 381-1233, Japan

2010

10.4028/www.scientific.net/KEM.447-448.61

Key engineering materials

Key engineering materials

ISSN：1013-9826
年,卷(期)：2010.447/448
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