首页|Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer

Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer

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  • NETL
  • NSTL
  • Trans Tech Publications Ltd
Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. However, effect of additive in CMG wheel is not completely understood yet. In this paper, three different CMG wheels were developed, in which one excluded additive and the other two contained two kinds of additive i.e. silicon dioxide and sodium carbonate. Grinding experiments were conducted to explore the influence of exclusion of additive and inclusion of different kinds of additive on CMG performance. The grinding characteristics of the three wheels were also analyzed and discussed to reveal the roles of wheel compositions in CMG process. This work provides some fundamental insights for the selection of different types of additive for optimization of CMG wheel.

silicon waferchemo-mechanical grindinggrinding wheeladditiveCMG

H. Takahashi、Y.B. Tian、Y. Mikami、J. Shimizu、L. Zhou、Y. Tashiro、H.lwase、S. Kamiya

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Department of Intelligent Systems Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Japan 316-8511

Organization for Creation of Collaboration and Innovation, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Japan 316-8511

Tokyo Diamond Tools Mfg. Co., Ltd., 2-3-5, Nakane, Meguro, Tokyo, Japan 152-0031

Toyota Motor Co., 1, Toyota, Toyota, Aichi, Japan 471-8572

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2010

10.4028/www.scientific.net/KEM.447-448.106

Key engineering materials

Key engineering materials

ISSN：1013-9826
年,卷(期)：2010.447/448
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