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Machined Surface Characteristics and Removal Mechanism of Soft and Brittle Solids

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Surface characteristics of CZT wafers machined using wire sawing, free abrasives lapping and polishing and ultra-precision grinding were investigated. Wire sawing resulted in the removal of material in both ductile and brittle regimes, but both polishing and grinding led to a ductile removal. The grinding produced very smooth surfaces free of embeddings and scratches, which is thus considered to have better machinability than the free abrasive machining. The nanoindentation and nanoscratch on MCT wafers at nanometric scales resulted in considerable plastic deformation, but no fracture features. The hardness of the MCT wafer was 500 to 550 MPa, and the coefficient of friction was particularly high, ranging from 0.45 to 0.55.

CdZnTeHgCdTenanomechanicsdamage mechanismultraprecision grinding

Zhenyu Zhang、Rudy Irwan、Han Huang

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School of Mechanical and Mining Engineering, The University of Queensland, QLD 4072, Australia

2010

10.4028/www.scientific.net/KEM.447-448.183

Key engineering materials

Key engineering materials

ISSN：1013-9826
年,卷(期)：2010.447/448
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