首页|Polishing Mechanism of Glass Substrates with Its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries

Polishing Mechanism of Glass Substrates with Its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries

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  • Trans Tech Publications Ltd
With an aim to reduce the consumption of cerium oxide (CeO_2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO_2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives.As a result, we have found Mn_2O_3 abrasives potential to replace disappearing CeO_2 for the polishing of glass substrates.

chemical mechanical polishing (CMP)glass substratescerium oxidemanganese oxideCeO2 slurryabrasives

T. Yamazaki、T. k. Doi、S. Kurokawa、S. lsayama、Y. Umezaki、Y.Matsukawa、H.Kono、Y. Akagami、Y.Yamaguchi、YKawase

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Department of Mechanical Engineering, Faculty of Engineering, Kyushu University, 744, Motooka, Nishi-ku, Fukuoka, 819-0395, Japan

Department of Mechanical Engineering, Faculty of Engineering, Kyushu University, 744, Motooka, Nishi-ku, Fukuoka, 819-0395, Japan Tokuyama Corporation, 3-3-1, Shibuya, Shibuya-ku, Tokyo, 150-8383, Japan

Akita Prefectural R&D Center, 4-11, Sanuki, Araya, Akita, 010-1623, Japan

Mitsui Mining & Smelting Co.,Ltd., 2081, Tosen, Omuta, Fukuoka, 836-0003, Japan

Mitsubishi Chemical Corporation, 4-14-1, Shiba, Minato-ku, Tokyo, 108-0014, Japan

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2010

10.4028/www.scientific.net/KEM.447-448.141

Key engineering materials

Key engineering materials

ISSN：1013-9826
年,卷(期)：2010.447/448
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