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Characterization of Silicon Wafer Surface Irradiated with Fiber Laser

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  • NETL
  • NSTL
  • Trans Tech Publications Ltd
We studied the feasibility of micromachining of silicon wafer using 200 W fiber laser of 1090 nm in wavelength. Irradiated area was observed and analyzed using scanning electron microscope and surface profiler. It was found that micromachining of silicon could not be carried out efficiently. Careful analyses revealed possible causes for the poor machinability: first, very weak plasma formed during the fiber laser-material interaction, leading to low evaporation or melt ejection; second, formation of large amounts of SiO_2 resulted in expansion of volume. It is further demonstrated that the surface oxidation can be made use of for the purpose of surface texturing.

fiber laserplasmalaser micro-machinability

Hamid Farrokhi、Wei Zhou、Hong Yu Zheng、Zhongli Li

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School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore

School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075, Singapore

Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075, Singapore

2010

10.4028/www.scientific.net/KEM.447-448.715

Key engineering materials

Key engineering materials

ISSN：1013-9826
年,卷(期)：2010.447/448
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