首页|Patent Application Titled 'Substrate Transfer Mechanism To ReduceBack-Side Substrate Contact” Published Online (USPTO 20230420279)
Patent Application Titled 'Substrate Transfer Mechanism To ReduceBack-Side Substrate Contact” Published Online (USPTO 20230420279)
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Reporters obtained the following quote from the background information supplied by the inventors: ““Field“The present disclosure generally relates to a method and apparatus for transferring substrates in aprocessing tool. More specifically, the present disclosure relates to a method and apparatus for transferringsubstrates in a chamber or multiple chambers of the processing tool.“Description of the Related Art“Ultra-large-scale integrated (ULSI) circuits may include more than one million electronic devices (e.g.,transistors) that are formed on a semiconductor substrate, such as a silicon (Si) substrate, and cooperateto perform various functions within the device.
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