首页|New Findings from Xidian University in the Area of Support Vector Machines Described (A Co-optimization Method of Thermal-stress Coupling 3d Integrated System With Through Silicon Via)
New Findings from Xidian University in the Area of Support Vector Machines Described (A Co-optimization Method of Thermal-stress Coupling 3d Integrated System With Through Silicon Via)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning DailyNews Daily News – Investigators publish new report on Support Vector Machines. According to newsreporting out of Xi’an, People’s Republic of China, by NewsRx editors, research stated, “In this paper, aco-optimization design method for thermal-stress coupling 3-dimensional integrated system with throughsilicon via is proposed based on the finite element method, support vector machine model and modifiedparticle swarm optimization algorithm. In the cause of analyzing the effects of geometrical parameters(radius of through silicon via, oxide thickness and the height of oxide insolation layer) on the thermal-stress distribution, the finite element method based COMSOL software is conducted to simulate the thermal-stresscoupling 3-dimensional integrated system.”
Xi’anPeople’s Republic of ChinaAsiaEmerging TechnologiesMachine LearningParticle Swarm OptimizationSupport Vector MachinesVector MachinesXidian University
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