Abstract
The following quote was obtained by the news editors from the background information supplied bythe inventors:“Field“Embodiments of the disclosure relate to semiconductor processing, and more specifically to electrostaticallychucking a substrate.“Description of the Related Art“Over the life of an electrostatic chuck, process drift can occur. For example, contaminants depositingon the electrostatic chuck and/or roughening of electrostatic chuck surfaces can cause changes in chuckingforces applied to substrates. The process drift can hinder processing operations, can cause substrate stickingand/or substrate breakage, can cause substrate pop-off during processing, can cause frontside defects andbackside defects on substrates, and can limit the operational lifespan of the electrostatic chuck.
NETL
NSTL